MINI LAPTOP FPC

MINI LAPTOP FPC
1.UL,ROHS,ISO,SGS,Layer:1-30
2.12years experience in PCB
3.Drill Size:0.1mm,Line:3mil
Immersion gold circuit pcb, pcba & fpc , multilayer pcb/MINI LAPTOP FPC
Our Factory Manufacture Capability

Item
Manufacture Capability
Material
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminum, Metal based
Layer No.
1-- 20
Finished Board thickness
0.2 mm-4.0mm’(8 mil-160 mil)
Board Thickness Tolerance
±10%
Cooper thickness
0.5 OZ-6OZ (18 um-210 um)
Copper Plating Hole
18-40 um
Impedance Control
±10%
Warp &Twist
0.50%
Peelable
0.012"(0.3mm)-0.02’(0.5mm)
I
mages
Min Trace Width
0.075mm (3mil)
Min Space Width
0.075mm (3mil)
Min Annular Ring
0.1mm (4 mil)
Solder Mask
Min Solder Mask Dam
0.0635 mm (2.5mil)
Solder mask Clearance
0.1mm (4 mil)
Holes
Min Hole size (CNC)
0.1 mm (4 mil)
Min Punch Hole Size
0.9 mm (35 mil)
Hole Size Tol (+/-)
PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol
±0.075mm
Plating
HASL
2.5um
Lead free HASL
2.5um
Immersion Gold
Nickel 3-7um Au:1-5u''
OSP
0.2-0.5um
Certificate
ROHS, SGS, UL, ISO9001: 2008.

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